Multichip Packages

Get critical features and functions to maximize your design — high performance, high quality, power efficiency, wide density ranges, small package sizes, industrial temperature ranges and more — from our broad portfolio of industry-standard multichip packages (MCPs).

Explore Micron Multichip Packages

View part catalogs, download data sheets, and find other product information.
e.MMC-Based MCP
Quick look
Benefits
  • Embedded managed NAND and High Performance LPDRAM in a single package
  • Simplified software solutions for complex high density NAND applications
  • Technology
    e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
View Details Launch Part Catalog
UFS-Based MCP (uMCP)
Quick look
Benefits
  • Embedded managed NAND and high-performance LPDRAM in a single package.
  • Enables high-density, low-power storage in a small footprint.
  • Technology
    LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
  • Densities
    UFS: 32GB; LPDRAM: 24Gb (3GB)
  • Package
    WFBGA
View Details
NAND-Based MCP
Quick look
Benefits
  • Offers high densities for data-intensive applications
  • Provides high speeds, with x8, x16 and x32 bus widths
  • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
  • Technology
    LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
  • Densities
    NAND: 1Gb - 8Gb
  • Package
    WFBGA, VFBGA, TFBGA, POP
View Details Launch Part Catalog

MCPs for Embedded IoT Applications

Embedded Internet of Things (IoT) applications are expanding into numerous markets across the globe including industrial, energy, retail, transportation, home automation, healthcare, automotive and security.
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